The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jan. 25, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/16 (2006.01); H01F 41/04 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); C08J 5/24 (2006.01); H01F 17/00 (2006.01); H05K 1/02 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4652 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C08J 5/24 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H05K 1/024 (2013.01); H05K 1/032 (2013.01); H05K 1/0373 (2013.01); H05K 1/16 (2013.01); H05K 1/165 (2013.01); H05K 3/46 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/0195 (2013.01);
Abstract
A method of manufacturing a multilayer board includes forming conductor patterns on four or more insulating base material layers, forming a multilayer body by stacking the insulating base material layers in a state in which the conductor patterns face each other with prepreg layers therebetween, and heat-pressing the multilayer body. In a state before the step of heat-pressing, among the prepreg layers, a thickness of an outermost prepreg layer is larger than a thickness of a prepreg layer other than the outermost prepreg layer.