The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jun. 08, 2020
Applicant:
Carnegie Mellon University, Pittsburgh, PA (US);
Inventors:
Carmel Majidi, Pittsburgh, PA (US);
Tong Lu, Pittsburgh, PA (US);
Eric J. Markvicka, Pittsburgh, PA (US);
Assignee:
CARNEGIE MELLON UNIVERSITY, Pittsburgh, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/30 (2006.01); H05K 3/06 (2006.01); A61N 1/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/028 (2013.01); H05K 1/0283 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/06 (2013.01); H05K 3/30 (2013.01); H05K 3/4644 (2013.01); A61N 1/00 (2013.01); H05K 3/027 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0248 (2013.01); H05K 2201/083 (2013.01); H05K 2203/107 (2013.01); H05K 2203/128 (2013.01); H05K 2203/1461 (2013.01);
Abstract
A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.