The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Oct. 11, 2019
Applicant:

Schlumberger Technology Corporation, Sugar Land, TX (US);

Inventors:

Swapna Arun Kumar, Sugar Land, TX (US);

Srinand Karuppoor, Sugar Land, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01); H05K 3/32 (2006.01); E21B 41/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); E21B 41/00 (2013.01); H05K 1/0306 (2013.01); H05K 1/112 (2013.01); H05K 3/12 (2013.01); H05K 3/32 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0175 (2013.01);
Abstract

An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.


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