The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Aug. 09, 2019
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

SI Flex Co., Ltd., Ansan-si, KR;

Inventors:

Sungwon Park, Suwon-si, KR;

Junghyub Kim, Ansan-si, KR;

Hwanyoul Jeong, Ansan-si, KR;

Seungyup Lee, Suwon-si, KR;

Youngsun Lee, Suwon-si, KR;

Hesuk Jung, Suwon-si, KR;

Eunseok Hong, Suwon-si, KR;

Assignees:

Samsung Electronics Co., Ltd., Suwon-si, KR;

SI FLEX CO., LTD., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); H05K 1/0219 (2013.01); H05K 1/0237 (2013.01); H05K 1/147 (2013.01);
Abstract

Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.


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