The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Jul. 22, 2020
Applicant:

Hella Gmbh & Co. Kgaa, Lippstadt, DE;

Inventors:

Frank Grueter, Lippetal, DE;

Thomas Hofmann, Zella-Mehlis, DE;

Matthias Mallon, Hamm, DE;

Melanie Loebel, Lippstadt, DE;

Assignee:

Hella GmbH & Co. KGaA, Lippstadt, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 1/021 (2013.01); H05K 1/0204 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10416 (2013.01);
Abstract

A circuit board heat sink structure having a circuit board and comprising a metallic heat sink, wherein the circuit board has a metal substrate, an insulation layer and a conductor layer, and the wherein the circuit board is arranged on the heat sink in such a way that the metal substrate contacts a locating face of the heat sink. At least one heat transition point is formed between the heat sink and the metal substrate, which provides a defined metallic contact between the material of the heat sink and the material of the metal substrate. A method is also provided for forming the circuit board heat sink structure.


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