The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Jul. 19, 2021
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Koichi Odagaki, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/0203 (2013.01); H05K 1/028 (2013.01); H05K 1/14 (2013.01); H05K 1/147 (2013.01); H05K 7/20445 (2013.01); H05K 1/0207 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An electronic apparatus that is improved in heat dissipation efficiency of a heat generating component while avoiding an increase in the size of the electronic apparatus. A first substrate has a heat generating component mounted thereon. A heat dissipation frame is arranged opposed to and in contact with a second substrate. A flexible printed circuit electrically connects the first and second substrates. A thermally conductive member is sandwiched between the heat generating component and the heat dissipation frame such that the flexible printed circuit is pressed against the heat generating component. As heat dissipation paths from the heat generating component to the heat dissipation frame, there are formed a first heat dissipation path via the thermally conductive member and a second heat dissipation path via the flexible printed circuit and the second substrate.


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