The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Sep. 03, 2021
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Yi-Ting Tsai, Kaohsiung, TW;

Jui-Hsiu Jao, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/108 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10814 (2013.01); H01L 23/528 (2013.01); H01L 27/10885 (2013.01); H01L 27/10888 (2013.01);
Abstract

The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a first bit line structure positioned above the substrate and including a first line portion arranged in parallel to a first direction, and a second line portion connecting to a first end of the first line portion and arranged in parallel to a second direction in perpendicular to the first direction; a first bit line top contact including a first bar portion positioned on the first end of the first line portion and arranged in parallel to the first direction, and a second bar portion connecting to a first end of the first bar portion, positioned on the second line portion, and arranged in parallel to the second direction; and a first top conductive layer electrically coupled to the first bit line top contact.


Find Patent Forward Citations

Loading…