The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jul. 08, 2021
Rfhic Corporation, Anyang-si, KR;
Won Sang Lee, Chapel Hill, NC (US);
RFHIC CORPORATION, Anyang-si, KR;
Abstract
In one embodiment, a semiconductor device includes a first substrate with a transistor formed in a first active are, a first bonding pad electrically connected to the transistor and a first metal pad surrounding the first active area. A second substrate of a type that is different from the first substrate includes a passive circuit element in a second active area on a front surface, a second bonding pad electrically connected to the passive circuit element, a second metal pad surrounding the second active area, and a mounting pad on a back surface of the second substrate with a through-via electrically connecting the second bonding pad to the mounting pad. A first interconnection extends from the first bonding pad to the second bonding pad, and a second interconnection extends from the first metal pad to the second metal pad and surrounds the region through which the first interconnection extends.