The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Mar. 30, 2020
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Shuangching Chen, Matsumoto, JP;

Sayaka Yamamoto, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01R 9/00 (2006.01); H05K 7/18 (2006.01); H01L 23/538 (2006.01); H02M 7/483 (2007.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 29/808 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/49534 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 29/1095 (2013.01); H01L 29/7393 (2013.01); H01L 29/7395 (2013.01); H01L 29/8083 (2013.01); H02M 7/483 (2013.01);
Abstract

A semiconductor device is provided, which includes a semiconductor chip; a first current input/output portion that is electrically connected to the semiconductor chip; a second current input/output portion that is electrically connected to the semiconductor chip; three or more conducting portions provided with the semiconductor chip, between the first current input/output portion and the second current input/output portion; and a current path portion having a path through which current is conducted to each of the three or more conducting portions, wherein the current path portion includes a plurality of slits.


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