The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Jul. 16, 2020
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Sunil Rao Ganta Papa Rao Bala, Houston, TX (US);

Matthew Kielbasa, Houston, TX (US);

Harvey Edward White, Jr., Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/34 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/345 (2013.01); H01L 23/04 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01);
Abstract

Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.


Find Patent Forward Citations

Loading…