The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
May. 19, 2020
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jin Ho Hong, Suwon-si, KR;
Youn Soo Kim, Suwon-si, KR;
Oh Choon Kwon, Suwon-si, KR;
Hyun Sub Oh, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/15 (2006.01); H01G 9/052 (2006.01); H01G 9/00 (2006.01); H01G 11/36 (2013.01); H01G 11/46 (2013.01); H01G 11/48 (2013.01); H01G 9/04 (2006.01);
U.S. Cl.
CPC ...
H01G 9/0525 (2013.01); H01G 9/0036 (2013.01); H01G 9/15 (2013.01); H01G 11/36 (2013.01); H01G 11/46 (2013.01); H01G 11/48 (2013.01); H01G 2009/05 (2013.01);
Abstract
A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35≤t2/t1≤0.9.