The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Mar. 21, 2022
Applicant:

Harbin Institute of Technology, Harbin, CN;

Inventors:

Zhiyin Sun, Harbin, CN;

Liyi Li, Harbin, CN;

Donghua Pan, Harbin, CN;

Kai Song, Harbin, CN;

Yuxi Liu, Harbin, CN;

Yinxi Jin, Harbin, CN;

Zhilong Zou, Harbin, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 13/00 (2006.01);
U.S. Cl.
CPC ...
H01F 13/006 (2013.01);
Abstract

A demagnetization method for a multilayer shielding apparatus is provided. In the demagnetization method, the demagnetization is realized on the basis of a demagnetization coil system. The demagnetization coil system includes a plurality of turns of demagnetization coils (), a plurality of connection wires and a power supply module. The multilayer shielding apparatus includes at least two layers of shielding bodies (); all the layers of shielding bodies () are sleeved layer by layer from inside to outside; a plurality of turns of demagnetization coils () are wound on each layer of shielding bodies () at intervals; and one half of each turn of demagnetization coils () is located inside the wound shielding bodies (), and the other half is located outside the wound shielding bodies (). Each demagnetization coil () is connected to the power supply module through the corresponding connection wire.


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