The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Nov. 22, 2018
Applicant:

Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, CN;

Inventor:

Wenliang Gong, Wuhan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/00 (2012.01); C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); G03F 7/028 (2006.01); C08F 222/10 (2006.01); C08F 265/06 (2006.01); C08K 5/315 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/028 (2013.01); C08F 2/50 (2013.01); C08F 222/102 (2020.02); C08F 222/103 (2020.02); C08F 265/06 (2013.01); C08K 5/315 (2013.01); G03F 7/0007 (2013.01);
Abstract

A photosensitive resin composition is provided. The photosensitive resin composition is applied in a technical field of flexible display devices. The photosensitive resin composition comprises 5 to 50 parts by weight of an acrylate crosslink monomer, 0.2 to 0.6 parts by weight of an initiator, 5 to 8 parts by weight of a liquid pigment solid substance, 5 to 8 parts by weight of a resin, and 20 to 70 parts by weight of a solvent. The initiator is a radical initiator having a decomposition temperature less than 40° C. The acrylate crosslink monomer comprises a copolymerization two of aromatic group-containing and triol-containing acrylate polymerizable monomers for lowering a temperature of a following color filter preparing process. A method of preparing the photosensitive resin composition and a display device comprising the photosensitive resin composition are also provided.


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