The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jan. 06, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Minwoo Kim, Cheonan-si, KR;
Jinho Choi, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor module inspection device is provided. The semiconductor module inspection device includes a receiver to store semiconductor modules; a loader to receive a semiconductor module from the receiver; a testing unit to receive the semiconductor module from the loader and perform a test process on the semiconductor module; an unloader to receive the semiconductor module from the testing unit and provide the semiconductor module from the testing unit to the receiver; and robots for transporting the semiconductor module. The robots include: a first robot to transport the semiconductor module from the receiver to the loader, a second robot to transport the semiconductor module from the loader to the testing unit, a third robot to transport the semiconductor module from the testing unit to the unloader, and a fourth robot to transport the semiconductor module from the unloader to the receiver.