The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Sep. 13, 2021
Allegro Microsystems, Llc, Manchester, NH (US);
Shixi Louis Liu, Hooksett, NH (US);
Paul A. David, Bow, NH (US);
Shaun D. Milano, Charlestown, NH (US);
Rishikesh Nikam, Manchester, NH (US);
Alexander Latham, Harvard, MA (US);
Wade Bussing, Manchester, NH (US);
Natasha Healey, Bedford, NH (US);
Georges El Bacha, Manchester, NH (US);
Allegro MicroSystems, LLC, Manchester, NH (US);
Abstract
A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.