The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Feb. 23, 2018
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Eisuke Tamura, Osaka, JP;
Seitaro Yamaguchi, Osaka, JP;
Hiromichi Momose, Osaka, JP;
Tomohiro Shiromaru, Osaka, JP;
Assignee:
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 127/18 (2006.01); A47J 36/02 (2006.01); C09D 5/02 (2006.01); C09D 127/22 (2006.01); C09D 179/08 (2006.01); C09D 181/04 (2006.01); C09D 181/06 (2006.01); C09D 181/02 (2006.01); C08L 27/12 (2006.01); C08L 81/02 (2006.01); C08L 81/06 (2006.01); C08L 101/00 (2006.01); C09D 127/12 (2006.01); C09D 201/00 (2006.01); C08L 79/08 (2006.01); C08L 81/04 (2006.01);
U.S. Cl.
CPC ...
C09D 127/18 (2013.01); A47J 36/025 (2013.01); C09D 5/02 (2013.01); C09D 127/22 (2013.01); C09D 179/08 (2013.01); C09D 181/04 (2013.01); C09D 181/06 (2013.01);
Abstract
The invention provides a composition that can provide a film exhibiting excellent adhesion to a substrate and having excellent non-stickiness. The composition contains a fluororesin, a heat-resistant resin, water, and a solvent having a boiling point of 205° C. or higher.