The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Feb. 14, 2022
Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, CN;

Inventors:

Teng Xu, Zhongshan, CN;

Zhilong Hu, Zhongshan, CN;

Shuwen Liu, Zhongshan, CN;

Cheng Li, Zhongshan, CN;

Yuhui Liu, Zhongshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); H05K 1/03 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); B32B 15/20 (2013.01); H05K 1/0346 (2013.01); B32B 2270/00 (2013.01); B32B 2457/08 (2013.01);
Abstract

A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. Moreover, the resin composition described above may also be made into articles such as a prepreg, a resin film, a laminate or a printed circuit board.


Find Patent Forward Citations

Loading…