The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Nov. 13, 2017
Applicants:

Polyone Corporation, Avon Lake, OH (US);

Gls Thermoplastic Alloys (Suzhou) Co., Ltd., Suzhou, CN;

Inventors:

Jiren Gu, Crystal Lake, IL (US);

Hanxing Wei, Suzhou, CN;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/00 (2006.01); B32B 27/28 (2006.01); B29C 70/68 (2006.01); C08G 77/16 (2006.01); C08G 77/445 (2006.01); C08L 25/08 (2006.01); C08L 75/04 (2006.01); C08L 83/06 (2006.01); C08L 83/10 (2006.01);
U.S. Cl.
CPC ...
C08L 75/00 (2013.01); B29C 70/68 (2013.01); B32B 27/283 (2013.01); C08G 77/16 (2013.01); C08G 77/445 (2013.01); C08L 25/08 (2013.01); C08L 75/04 (2013.01); C08L 83/06 (2013.01); C08L 83/10 (2013.01); B32B 2250/24 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/748 (2013.01);
Abstract

An overmolded thermoplastic article includes a substrate portion molded from a thermoplastic resin compound and an overmold portion molded from a thermoplastic elastomer compound. The thermoplastic resin compound includes thermoplastic polymer resin. The thermoplastic elastomer compound includes thermoplastic elastomer and polysiloxane as a mold release agent, and is free of wax. The overmold portion is bonded onto the substrate portion with a peel strength at least comparable to that of an overmolded thermoplastic elastomer compound containing wax as a mold release agent instead of the polysiloxane. Undesirable effects observed with the use of wax as a mold release agent in overmolded thermoplastic elastomer compounds such as blooming and ease of scratching/marring can be reduced, while desirable properties such as silky feel of the surface of the overmold portion and good bonding of the overmold portion onto the substrate portion can be at least maintained.


Find Patent Forward Citations

Loading…