The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Apr. 11, 2018
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Aya Shuto, Kanagawa, JP;
Kenichi Kurihara, Kanagawa, JP;
Nobuhiro Kihara, Aichi, JP;
Yusuke Kajio, Tokyo, JP;
Tomomasa Watanabe, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/30 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B33Y 40/20 (2020.01); B29C 64/147 (2017.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/30 (2017.08); B29C 64/147 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B29K 2105/0032 (2013.01);
Abstract
A three-dimensional structure according to an embodiment of the present disclosure includes: a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked, the color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less.