The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2022

Filed:

Jun. 16, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Wataru Kobayashi, Kariya, JP;

Takumi Nomura, Kariya, JP;

Yukinori Yamashita, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/352 (2014.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 26/355 (2018.08); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/3584 (2018.08); H01L 23/3107 (2013.01); H01L 23/49513 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); B23K 2103/08 (2018.08); H01L 2224/29099 (2013.01); H01L 2224/32245 (2013.01);
Abstract

An electronic device includes a support member and a mount member mounting on the support member. The support member and the mount member are sealed by a resin member. The support member includes a surface having a laser irradiation mark. The mount member includes a surface having a rough portion with an accumulation of material of the support member.


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