The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Nov. 07, 2019
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Pai-Chi Tsai, Miao-Li County, TW;
Wen-Chieh Lin, Miao-Li County, TW;
Assignee:
INNOLUX CORPORATION, Miao-Li County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); H05K 1/028 (2013.01); H05K 3/04 (2013.01); H05K 2201/035 (2013.01); H05K 2201/051 (2013.01); H05K 2201/0909 (2013.01); H05K 2203/0147 (2013.01); H05K 2203/0221 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0562 (2013.01);
Abstract
A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.