The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
May. 06, 2020
Applicant:
Koito Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Shinya Kusazaki, Shizuoka, JP;
Hiroki Ishibashi, Shizuoka, JP;
Assignee:
KOITO MANUFACTURING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 13/04 (2006.01); F21S 41/151 (2018.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); F21S 41/151 (2018.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/3431 (2013.01); H05K 13/0469 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/0465 (2013.01);
Abstract
An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.