The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Dec. 15, 2020
Applicant:
Toppan Printing Co.,ltd., Tokyo, JP;
Inventor:
Tetsuyuki Tsuchida, Tokyo, JP;
Assignee:
TOPPAN PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); C25D 7/00 (2013.01); H05K 1/0242 (2013.01); H05K 1/09 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/0344 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.