The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Feb. 21, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Lalan Jee Mishra, San Diego, CA (US);

Richard Dominic Wietfeldt, San Diego, CA (US);

James Lionel Panian, San Marcos, CA (US);

Georgios Konstantinos Paparrizos, Foster City, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/42 (2006.01); H01R 13/533 (2006.01); H01R 13/66 (2006.01); H01R 24/28 (2011.01); H01R 25/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6683 (2013.01); H01B 7/42 (2013.01); H01B 7/421 (2013.01); H01R 13/533 (2013.01); H01R 13/6675 (2013.01); H01R 24/28 (2013.01); H01R 25/003 (2013.01);
Abstract

Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivity may dissipate excess heat from the cable into the environment. In another aspect, a USB cable connector or the USB receptacle portion of a device may include a thermoelectric heat pump. The thermoelectric heat pump may move excess heat from the cable assembly or receptacle into a portion of the cable assembly or device that dissipates the heat into the environment.


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