The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Jan. 26, 2021
Interface Technology (Chengdu) Co., Ltd., Sichuan, CN;
Interface Optoelectronics (Shenzhen) Co., Ltd., Guangdong, CN;
General Interface Solution Limited, Miaoli County, TW;
Ping-Hsiang Kao, Guangdong, CN;
Po-Lun Chen, Guangdong, CN;
Chun-Ta Chen, Guangdong, CN;
Po-Ching Lin, Guangdong, CN;
Ya-Chu Hsu, Guangdong, CN;
Chia-Ming Fan, Guangdong, CN;
Chien-Yu Huang, Guangdong, CN;
Interface Technology (ChengDu) Co., Ltd., Sichuan, CN;
Interface Optoelectronics (ShenZhen) Co., Ltd., Guangdong, CN;
General Interface Solution Limited, Miaoli County, TW;
Abstract
The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.