The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Jul. 29, 2019
Applicant:
Agency for Science, Technology and Research, Singapore, SG;
Inventors:
Assignee:
Agency for Science, Technology and Research, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/00 (2006.01); H05K 7/18 (2006.01); H05K 7/20 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/34 (2013.01); H01L 23/3677 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/5385 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/473 (2013.01); H01L 23/49513 (2013.01); H01L 23/49579 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13091 (2013.01);
Abstract
Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.