The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Jul. 13, 2017
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Takashi Nakajima, Tokyo, JP;

Keiko Shiroki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/32 (2006.01); H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 41/042 (2013.01); H01F 2027/2809 (2013.01);
Abstract

One object is to suppress thermal shrinkage of a cover resin layer at the time of thermal curing. A laminated coil according to one embodiment of the present invention is provided with a magnetic substrate formed of a sintered magnetic material, an insulation resin layer formed on the magnetic substrate, a cover resin layer formed on the insulation resin layer, and a coil conductor embedded in the insulation resin layer. In one embodiment of the present invention, said insulation resin layer includes a first resin and first filler particles, and said cover resin layer includes a second resin and second filler particles. A filling factor of the second filler particles in the cover resin layer is higher than a filling factor of the first filler particles in the insulation resin layer.


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