The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Dec. 09, 2020
Applicant:

Sakai Display Products Corporation, Sakai, JP;

Inventors:

Katsuhiko Kishimoto, Sakai, JP;

Yozo Narutaki, Sakai, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); G06F 3/045 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0443 (2019.05); G06F 3/0412 (2013.01); H01L 27/323 (2013.01); H01L 27/3276 (2013.01); H01L 51/0097 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); G06F 3/045 (2013.01); G06F 3/0446 (2019.05); G06F 2203/04102 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01);
Abstract

According to an embodiment of the invention, the organic EL device () comprises: an element substrate () having a substrate () and a plurality of organic EL elements () supported by the substrate; a thin film encapsulation structure () formed above the plurality of organic EL elements and having at least one compound layered body (S) constituted by a first inorganic barrier layer (), an organic barrier layer () in contact with the upper surface of the first inorganic barrier layer and having a plurality of solid sections spread out discretely, and a second inorganic barrier layer () in contact with the upper surface of the first inorganic barrier layer and the upper surfaces of the plurality of solid sections of the organic barrier layer; an organic planarization layer () provided above the thin film encapsulation structure and formed from a photosensitive resin; and a touch sensor layer () disposed above the organic planarization layer.


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