The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Jun. 18, 2021
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventor:

Christopher L. Chua, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H04B 10/25 (2013.01); H01L 23/498 (2006.01); H04B 10/40 (2013.01); H01L 31/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4278 (2013.01); G02B 6/423 (2013.01); G02B 6/4246 (2013.01); H01L 23/49811 (2013.01); H01L 31/12 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01);
Abstract

A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mmper Gbps.


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