logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11513262 B1

PDFFull Text
Date of Patent:
Nov. 29, 2022

Filed:

Mar. 08, 2019

Method for manufacturing structure

Applicant:

Konica Minolta, Inc., Tokyo, JP;

Inventor:

Yoshinobu Ehara, Hino, JP;

Assignee:

KONICA MINOLTA, INC., Tokyo, JP;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

John L Goff, II

Int. Cl.
CPC ...
G02B 3/00 (2006.01); B29D 11/00 (2006.01); B32B 37/04 (2006.01); B29C 65/70 (2006.01); B29C 65/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); B32B 37/12 (2006.01); B29K 23/00 (2006.01); B29K 709/08 (2006.01);
U.S. Cl.
CPC ...
G02B 3/0012 (2013.01); B29C 65/70 (2013.01); B29C 66/8141 (2013.01); B29C 66/91941 (2013.01); B29D 11/00413 (2013.01); B32B 37/04 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); G02B 3/0068 (2013.01); B29K 2023/38 (2013.01); B29K 2709/08 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2305/72 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2310/00 (2013.01); B32B 2551/00 (2013.01);
Abstract

A method is for manufacturing a structure obtained by stacking a substrate that is a first member as a base material, and lens arrays that are second members that are opposed to the substrate, are formed of a resin material different from the substrate, and have a shape on a surface. The method includes a surface activation step of performing an activation treatment to cause an activation state of at least one of a surface of the substrate or a surface of the lens arrays, and a bonding step of pressurizing the lens arrays at least at a temperature that is equal to or higher than a reference temperature obtained by subtracting 30° C. from a load deflection temperature of a resin material of the lens arrays, and is equal to or lower than a glass transition temperature, to closely bond to the substrate.

Find Patent Forward Citations

Loading…