The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Aug. 02, 2017
Japan Polypropylene Corporation, Chiyoda-ku, JP;
Satoshi Katsuno, Mie, JP;
Kazuo Asuka, Mie, JP;
Hayato Kitaura, Mie, JP;
Morikazu Niibe, Mie, JP;
Kuninori Takahashi, Mie, JP;
Japan Polypropylene Corporation, Chiyoda-ku, JP;
Abstract
This decorative film is to be bonded to a resin molded body by means of thermoforming, and comprises a sealing layer (I) that contains a polypropylene resin (A) and a layer (II) that contains a polypropylene resin (B). The polypropylene resin (A) satisfies the requirement (a1), while the polypropylene resin (B) satisfies the requirement (b1). (a1) The melt flow rate (MFR (A)) (at 230° C. under a load of 2.16 kg) is more than 0.5 g/10 minutes. (b1) The melt flow rate (MFR (B)) (at 230° C. under a load of 2.16 kg) and the MFR (A) satisfy relational expression (b-1). MFR (B)<MFR (A) (b-1).