The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2022
Filed:
Sep. 17, 2020
Seiko Epson Corporation, Tokyo, JP;
Hiroki Takano, Nagano, JP;
Kakeru Sasagawa, Nagano, JP;
Kei Yokota, Nagano, JP;
Kenta Anegawa, Nagano, JP;
Seiichiro Yamashita, Nagano, JP;
Riona Hayashi, Nagano, JP;
Yuji Shinbaru, Nagano, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
An injection molding system includes: an injection molding machine configured to operate in accordance with a command generated using a first language, and inject a molten material into a mold to mold a molded object; a robot configured to operate in accordance with a command generated using a second language, and convey the molded object; and a control device configured to control the injection molding machine and the robot. When determining that an error occurs in at least one of the injection molding machine and the robot, the control device transmits, to the injection molding machine, a command generated using the first language and for causing the injection molding machine to execute a return operation, and transmits, to the robot, a command interpretable by the second language and for causing the robot to execute a return operation, so as to cause the injection molding machine and the robot to execute the return operations.