The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Feb. 24, 2021
Applicants:

Honda Motor Co., Ltd., Tokyo, JP;

University of Tennessee Research Foundation, Knoxville, TN (US);

Colorado School of Mines, Golden, CO (US);

Inventors:

Jianxun Hu, Dublin, OH (US);

Justin Brown, West Mansfield, OH (US);

Peiyong Chen, Knoxville, TN (US);

Chanho Lee, Knoxville, TN (US);

Xuesong Fan, Knoxville, TN (US);

John William Bohling, Knoxville, TN (US);

Carl D. Lundin, Knoxville, TN (US);

Peter Liaw, Knoxville, TN (US);

Zhenzhen Yu, Golden, CO (US);

Abdelrahman Abdelmotagaly, Golden, CO (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 11/20 (2006.01); C22C 30/02 (2006.01); B23K 101/00 (2006.01); B23K 103/20 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3093 (2013.01); B23K 11/20 (2013.01); B23K 35/302 (2013.01); B32B 15/012 (2013.01); C22C 30/02 (2013.01); B23K 35/30 (2013.01); B23K 35/3026 (2013.01); B23K 35/3033 (2013.01); B23K 2101/006 (2018.08); B23K 2103/20 (2018.08);
Abstract

A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.


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