The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Aug. 27, 2018
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Ryan Wade Penny, Cambridge, MA (US);

Anastasios John Hart, Waban, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/70 (2014.01); G01N 21/95 (2006.01); B23K 31/12 (2006.01); B23K 26/03 (2006.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/082 (2014.01); B23K 26/0622 (2014.01); B29C 64/30 (2017.01); B29C 64/393 (2017.01); G01N 21/84 (2006.01); G01N 21/94 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/0626 (2013.01); B23K 26/073 (2013.01); B23K 26/0821 (2015.10); B23K 26/70 (2015.10); B29C 64/30 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B23K 26/702 (2015.10); B23K 31/125 (2013.01); G01N 21/8422 (2013.01); G01N 21/94 (2013.01); G01N 21/95 (2013.01);
Abstract

Systems, devices, and methods for additive manufacturing are provided that allow for components being manufactured to be assessed during the printing process. As a result, changes to a print plan can be considered, made, and implemented during the printing process. More particularly, in exemplary embodiments, a spectrometer is operated while a component is being printed to measure one or more parameters associated with one or more layers of the component being printed. The measured parameter(s) are then relied upon to determine if any changes are needed to the way printing is occurring, and if such changes are desirable, the system is able to implement such changes during the printing process. By way of non-limiting examples, printed material in one or more layers may be reheated to alter the printed component, such as to remove defects identified by the spectrometer data. A variety of systems, devices, and methods for performing real-time sensing and control of an additive manufacturing process are also provided.


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