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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11510727 B1

PDFFull Text
Date of Patent:
Nov. 29, 2022

Filed:

Aug. 13, 2019

Treatment instrument and manufacturing method of treatment instrument

Applicant:

Olympus Corporation, Hachioji, JP;

Inventor:

Tsunetaka Akagane, Hachioji, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Shawntina T Fuqua

Int. Cl.
CPC ...
A61B 18/14 (2006.01); B32B 7/12 (2006.01); H05B 3/03 (2006.01); H05B 3/06 (2006.01); H05B 3/36 (2006.01); A61B 17/00 (2006.01); A61B 18/00 (2006.01);
U.S. Cl.
CPC ...
A61B 18/1445 (2013.01); B32B 7/12 (2013.01); H05B 3/03 (2013.01); H05B 3/06 (2013.01); H05B 3/36 (2013.01); A61B 2017/00526 (2013.01); A61B 2018/00077 (2013.01); A61B 2018/00083 (2013.01); A61B 2018/00095 (2013.01); H05B 2203/017 (2013.01);
Abstract

A treatment instrument including a heat transmitter that includes a treating surface and an installation surface, a substrate attached to the installation surface, and a heat generator formed on a surface of the substrate. The substrate surface and heat generator together form an uneven surface. First and second adhesion layers formed of a material having thermal conductivity and electrical insulation are provided between the installation surface and the substrate. The first adhesion layer is in close contact with the installation surface, and the second adhesion layer is in close contact with the heat generator and the substrate surface. The second adhesion layer is inserted into a recess in the uneven surface formed by the heat generator on substrate surface so as to increase the contact area between the second adhesion layer and the uneven surface.

Find Patent Forward Citations

Akagane, Tsunetaka. (2022). Treatment instrument and manufacturing method of treatment instrument (U.S. Patent No. 11510727). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11510727

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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