The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

May. 07, 2018
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Stefan Schibli, Frankfurt am Main, DE;

Heiko Specht, Hanau, DE;

Ilias Nikolaidis, Frankfurt am Main, DE;

Parth Bhimani, Bremen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 18/14 (2006.01); A61B 5/00 (2006.01); A61M 25/00 (2006.01); A61L 29/06 (2006.01); A61L 29/02 (2006.01); A61L 29/14 (2006.01); G01L 1/18 (2006.01); A61B 18/00 (2006.01); A61B 90/00 (2016.01);
U.S. Cl.
CPC ...
A61B 5/6852 (2013.01); A61B 5/6885 (2013.01); A61B 18/1492 (2013.01); A61L 29/02 (2013.01); A61L 29/06 (2013.01); A61L 29/14 (2013.01); A61L 29/146 (2013.01); A61M 25/0009 (2013.01); A61M 25/0045 (2013.01); G01L 1/18 (2013.01); A61B 2018/00577 (2013.01); A61B 2090/065 (2016.02); A61B 2562/0219 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/0261 (2013.01); A61B 2562/12 (2013.01); A61B 2562/166 (2013.01);
Abstract

One aspect relates to a conductive polymer composite based sensor, a detection unit comprising such sensor, a method for manufacturing a conductive polymer composite based sensor, and a use of the conductive polymer composite based sensor or the detection unit. The conductive polymer composite based sensor includes a substrate and a sensor material. The sensor material includes an insulating polymer matrix component and an electrically conductive component dispersed in the polymer matrix component to form the conductive polymer composite. The sensor material is pre-strained and applied to the substrate to form the sensor.


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