The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jul. 21, 2020
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

MinWoo Jeong, Seoul, KR;

Chun Hyuk Ryu, Seoul, KR;

Jongkil Shin, Seoul, KR;

BongJun Kim, Seoul, KR;

Minjae Park, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 13/16 (2006.01); H01L 23/467 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20009 (2013.01); F28F 13/16 (2013.01); H01L 23/467 (2013.01); H05K 7/20154 (2013.01); H01L 23/367 (2013.01); H01L 23/3733 (2013.01); H05K 7/20409 (2013.01);
Abstract

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element () installed in a casing (C); a heat dissipation means () causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (). The heat dissipation bridge () exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element () and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element () to the heat sink. Accordingly, two means of the heat dissipation means () and the heat dissipation bridge () simultaneously cool the heating element (), so cooling efficiency is improved.


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