The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Dec. 18, 2019
Applicant:

Yungu (Gu'an) Technology Co., Ltd., Langfang, CN;

Inventors:

Yu Zhang, Langfang, CN;

Suhua Li, Langfang, CN;

Peng Wang, Langfang, CN;

Dong Ding, Langfang, CN;

Hailiang Liu, Langfang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); H05K 3/38 (2006.01); H01B 5/14 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H01L 27/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H01B 5/14 (2013.01); H01L 27/28 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 3/382 (2013.01); H05K 3/388 (2013.01);
Abstract

The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.


Find Patent Forward Citations

Zhang, Yu. (2022). Conductive laminated structure, a manufacturing method thereof, and a display panel (U.S. Patent No. 11510323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11510323

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…