The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Nov. 12, 2020
Applicant:

Tpk Advanced Solutions Inc., Fujian, CN;

Inventors:

Xian-Bin Xu, Xiamen, CN;

Ming-Qiang Fu, Liancheng County, CN;

He Luo, Longchang, CN;

Chen-Hsin Chang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H05K 1/028 (2013.01); H05K 3/10 (2013.01);
Abstract

An electronic device includes a substrate and a flexible printed circuit board. The substrate includes a plurality of first pins disposed on the substrate. The flexible printed circuit board includes a plurality of second pins disposed on the flexible printed circuit board. The first pins and the second pins are bonded to each other to form a plurality of bonding points. The bonding points include at least one central bonding point and at least one first bonding point. The at least one central bonding point is located in a central area of the electronic device. The at least one first bonding point is located in a first area of the electronic device. The first area is located outside the central area. A line width of the at least one first bonding point is greater than a line width of the at least one central bonding point.


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