The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Mar. 11, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Issei Yamamoto, Kyoto, JP;
Akio Katsube, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 5/0034 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10545 (2013.01);
Abstract
An electronic component module () includes a module board () having electronic components () mounted on at least one of a first surface (front surface) () and a second surface (back surface) (), mold portions (and), and a shield (). The mold portions (and) cover the mounted electronic components (). The shield () covers at least a part of the mold portions (and) and the side surfaces of the module board (). Protrusions () protruding from the side surfaces are formed on the module board (). The shield () is separated by the protrusions ().