The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jan. 17, 2020
Applicant:

Agc Inc., Tokyo, JP;

Inventors:

Yuhei Gima, Tokyo, JP;

Seiichi Miyasaka, Tokyo, JP;

Shigeru Nakamura, Tokyo, JP;

Assignee:

AGC INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/86 (2006.01); B32B 17/10 (2006.01); H05B 3/34 (2006.01);
U.S. Cl.
CPC ...
H05B 3/86 (2013.01); B32B 17/10036 (2013.01); H05B 3/34 (2013.01); H05B 2203/002 (2013.01); H05B 2203/011 (2013.01); H05B 2203/014 (2013.01);
Abstract

A laminated glass includes a pair of glass plates facing each other, a pair of intermediate adhesive layers positioned between the pair of glass plates and in contact with the respective glass plates, a wiring positioned between the pair of intermediate adhesive layers, and one set of bus bars connected to the wiring. The wiring includes conductive thin wires arranged in parallel with each other between the bus bars. The bus bars are arranged alongside a same edge of the glass plates. In an area corresponding to at least a part of a principal face of the glass plates, the conductive thin wires are arranged as one aggregation and include at least one turnaround. A resistance value of each of the conductive thin wires is within a range of 10% or less with respect to an average value of resistance values of the conductive thin wires.


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