The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jan. 08, 2019
Applicant:

Molex, Llc, Lisle, IL (US);

Inventors:

Teng-Kai Chen, San Jose, CA (US);

John C. Laurx, Aurora, IL (US);

Li Zhuang, Long Grove, IL (US);

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/6586 (2011.01); H01R 9/24 (2006.01); H01R 12/70 (2011.01); H01R 13/6471 (2011.01); H01R 13/6599 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6586 (2013.01); H01R 9/2408 (2013.01); H01R 12/7076 (2013.01); H01R 13/6471 (2013.01); H01R 13/6599 (2013.01);
Abstract

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g.,and) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g.,). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.


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