The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Aug. 27, 2020
Applicant:

Movandi Corporation, Irvine, CA (US);

Inventors:

Seunghwan Yoon, Irvine, CA (US);

Franco De Flaviis, Irvine, CA (US);

Alfred Grau Besoli, Irvine, CA (US);

Kartik Sridharan, San Diego, CA (US);

Ahmadreza Rofougaran, Newport Beach, CA (US);

Michael Boers, South Turramurra, AU;

Sam Gharavi, Irvine, CA (US);

Donghyup Shin, Irvine, CA (US);

Farid Shirinfar, Granada Hills, CA (US);

Stephen Wu, Fountain Valley, CA (US);

Maryam Rofougaran, Rancho Palos Verdes, CA (US);

Assignee:

SILICON VALLEY BANK, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 21/06 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/065 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/045 (2013.01); H01Q 21/0025 (2013.01);
Abstract

Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.


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