The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jun. 16, 2020
Applicant:

Taoglas Group Holdings Limited, San Diego, CA (US);

Inventors:

Jeffrey Keith Shamblin, San Marcos, CA (US);

Vladimir Furlan, Munich, DE;

Patrick Carl Frank, Minneapolis, MN (US);

Assignee:

TAOGLAS GROUP HOLDINGS LIMITED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/06 (2006.01); H01Q 9/16 (2006.01); H05K 1/02 (2006.01); H01Q 1/12 (2006.01); H04B 7/06 (2006.01); H01Q 9/06 (2006.01); H01Q 21/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/062 (2013.01); H01Q 1/12 (2013.01); H01Q 9/065 (2013.01); H01Q 9/16 (2013.01); H01Q 21/24 (2013.01); H04B 7/0617 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.


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