The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Dec. 18, 2017
Applicant:

Eve Energy Co., Ltd., Huizhou, CN;

Inventors:

Jibing Jiang, Huizhou, CN;

Yanqiang Feng, Huizhou, CN;

Dingding Yuan, Huizhou, CN;

Guomin Huang, Huizhou, CN;

Jincheng Liu, Huizhou, CN;

Assignee:

EVE ENERGY CO., LTD., Guangdong, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/613 (2014.01); H01M 10/617 (2014.01); H01M 10/625 (2014.01); H01M 10/653 (2014.01); H01M 10/6567 (2014.01); H01M 10/658 (2014.01); H01M 50/20 (2021.01);
U.S. Cl.
CPC ...
H01M 10/613 (2015.04); H01M 10/617 (2015.04); H01M 10/625 (2015.04); H01M 10/653 (2015.04); H01M 10/658 (2015.04); H01M 10/6567 (2015.04); H01M 50/20 (2021.01); H01M 2220/20 (2013.01);
Abstract

A thermal management power battery assembly and a battery pack having a plurality of the thermal management power battery assemblies connected in series. The battery assembly includes a plurality of staggered battery cells, a thermal conduction module, a liquid cooling module, and a battery cell fixing module for fixing the battery cells. The battery cell fixing module includes a battery cell position limiting device, and assembly supporting device located at two sides of the battery cell position limiting device; the liquid cooling module is integrated in the assembly supporting device; the thermal conduction module is simultaneously in contact with the battery cells and the assembly supporting device. The liquid cooling module is integrated with the assembly supporting device. The liquid cooling module is intergrated with the assembly supporting device.


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