The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Aug. 12, 2020
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Geunwoo Yug, Seoul, KR;

Mu-Hyun Kim, Seoul, KR;

Bon-Joo Koo, Cheonan-si, KR;

Taehyun Jung, Seoul, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); B23K 26/70 (2014.01); B23K 26/38 (2014.01); B23K 26/0622 (2014.01); B23K 26/08 (2014.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); B23K 26/0624 (2015.10); B23K 26/08 (2013.01); B23K 26/0876 (2013.01); B23K 26/38 (2013.01); B23K 26/706 (2015.10); H01L 27/3234 (2013.01); H01L 27/3244 (2013.01); H01L 51/0097 (2013.01); B23K 2101/36 (2018.08); H01L 2251/5338 (2013.01); H01L 2251/566 (2013.01);
Abstract

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.


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