The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jul. 24, 2020
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Shinji Miyazawa, Kanagawa, JP;

Yoshiaki Masuda, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 25/18 (2006.01); H04N 5/374 (2011.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 25/07 (2006.01); H04N 5/369 (2011.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 21/768 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 27/1469 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H04N 5/374 (2013.01); H04N 5/379 (2018.08); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73257 (2013.01);
Abstract

The present disclosure relates to an image pickup device and an electronic apparatus that enable further downsizing of device size. The device includes: a first structural body and a second structural body that are layered, the first structural body including a pixel array unit, the second structural body including an input/output circuit unit, and a signal processing circuit; a first through-via, a signal output external terminal, a second through-via, and a signal input external terminal that are arranged below the pixel array, the first through-via penetrating through a semiconductor substrate constituting a part of the second structural body, the second through-via penetrating through the semiconductor substrate; a substrate connected to the signal output external terminal and the signal input external terminal; and a circuit board connected to a first surface of the substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.


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