The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
Jul. 19, 2018
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventors:
Hiroaki Onuma, Sakai, JP;
Takashi Ono, Sakai, JP;
Hiroyoshi Higashisaka, Sakai, JP;
Tsuyoshi Ono, Sakai, JP;
Takashi Kurisu, Sakai, JP;
Toshio Hata, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 27/15 (2006.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 27/156 (2013.01); H01L 33/0093 (2020.05); H01L 33/60 (2013.01); H01L 33/20 (2013.01);
Abstract
A semiconductor module includes a ground substrate that is provided with a drive circuit, and a plurality of light emitting elements that are electrically coupled to the drive circuit, in which a distance between the light emitting elements adjacent to each other is equal to or less than 20 μm in a top view.