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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11508644 B1

PDFFull Text
Date of Patent:
Nov. 22, 2022

Filed:

Feb. 26, 2021

Semiconductor device package having thermally conductive pathways

Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Yazhou Zhang, Shanghai, CN;

Shineng Ma, Shanghai, CN;

Kent Yang, Hsinchu, TW;

Hope Chiu, Shanghai, CN;

Assignee:

WESTERN DIGITAL TECHNOLOGIES, INC., San Jose, CA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Errol V Fernandes

Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 21/3065 (2013.01); H01L 21/311 (2013.01); H01L 21/56 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73204 (2013.01);
Abstract

A semiconductor device package includes a substrate, a first heat-generating component positioned on a surface of the substrate, an encapsulant at least partially encapsulating the first heat-generating component, and one or more channels extending through a portion of the encapsulant toward the first heat-generating component. Each of the one or more channels contains a thermally conductive material having a thermal conductivity greater than a thermal conductivity of the encapsulant.

Find Patent Forward Citations

Zhang, Yazhou. (2022). Semiconductor device package having thermally conductive pathways (U.S. Patent No. 11508644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11508644

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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