The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Oct. 19, 2018
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Keisuke Okumura, Osaka, JP;

Yoshihiro Furukawa, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H02J 50/10 (2016.01); H01F 38/14 (2006.01); H01F 41/04 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01F 38/14 (2013.01); H01F 41/041 (2013.01); H02J 50/10 (2016.02); H05K 1/165 (2013.01); H01F 2017/0066 (2013.01);
Abstract

A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.


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